Conductive adhesives – seminar and workshops Dec 10th

Publicerad: 07 December 2018

Date: December 10, 2018
Place: Östsvenska Handelskammaren, Dalsgatan 13, Norrköping

10:30 – 11:30 Seminar by Professor Johan Liu, Chalmers

Title: Conductive adhesives for micro-assembly. State-of-the-art and current developments
Conductive adhesives are widely used in electronic packaging and in manufacturing of devices, such as large-area displays and smart phones. This class of adhesive materials is expected to grow in importance as a possible replacement for soldering. New fields of application related to printed and flexible electronics, IoT, cellulose-based substrates and demands on manufacturing conditions offer challenges and demands for further development.
Prof. Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. He served in various positions at the Swedish Institute for Production Engineering Research (IVF, now part of RISE) as project manager, group leader and division manager before becoming a professor in electronics production at Chalmers University of Technology. He has published the book entitled “Conductive adhesives for electronics packaging” which is the only book in the field. He also has over 120 journal and conference publications in this field and received the IEEE CPMT Transactions best paper award for his work regarding anisotropic conductive adhesives in electronics packaging applications.

11:30 – 12:15 Micro-assembly and printing at Printed Electronics Arena (PEA)
12:30– 13:30 Lunch (Place: Östsvenska handelskammaren)
13:30 – 16:00 Workshops  (limited number of participants)
WS1. Characterization of conductive adhesive joints, electrically and mechanically
WS2. Materials and stability
WS3. Challenges, issues and current development
WS4. Space for other topics
Registration and questions by November 23, 2018 via email to: mats.sandberg@ri.se
Registration fee: 500 SEK (invoiced later, not for partners of organizing projects